HCC25HETN

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Specifications

Termination:Solder
Series:-
Read Out:Single
Pitch:0.100" (2.54mm)
Packaging:Tray
Operating Temperature:-65°C ~ 125°C
Number of Rows:1
Number of Positions/Bay/Row:-
Number of Positions:25
Mounting Type:Through Hole
Moisture Sensitivity Level (MSL):1 (Unlimited)
Material - Insulation:Polybutylene Terephthalate (PBT)
Manufacturer Standard Lead Time:3 Weeks
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Gender:Female
Flange Feature:-
Features:-
Contact Type:Cantilever
Contact Material:Beryllium Copper
Contact Finish Thickness:30.0µin (0.76µm)
Contact Finish:Gold
Color:-
Card Type:Non Specified - Dual Edge
Card Thickness:0.062" (1.57mm)